Technology
Material science meets system design.
— PLATFORM —
Unifying the Interconnect
For decades, electronic systems have been built using a disaggregated supply chain and material sets: PCBs, substrates, interposers, laminates, build up films, and redistribution layers developed in isolation rather than as a unified, optimized system. The result is predictable: complex supply chains, inefficient architectures, and enormous power costs in today’s AI infrastructure. Thintronics is changing this.
Our Solution
A universal insulator that delivers near theoretical insertion loss and integrates into every standard build-up circuit manufacturing process (SAP, mSAP, ETS, and subtractive).
Why It Matters
The lines between PCBs, substrates, and interposers are blurring. A single, optimized insulator platform simplifies architectures, improves performance, and strengthens the supply chain. Thintronics provides the foundation for the transition to true heterogeneous integration.
Performance Foundation
The Lowest Insertion Loss: Period. Power Efficiency: Thintronics technology enables the transition to 224G–448G die-to-die and optical links with less equalization power, which can result in a 42% reduction in SERDES power. Frequency Stable: Our platform maintains signal fidelity at the extreme frequencies demanded by AI accelerators and high-performance computing, supporting data rates beyond 224Gbps.
Supply Chain Security
One form factor means one supply path: simplifying sourcing and reducing monopolistic bottlenecks. Thintronics also delivers an order of magnitude higher manufacturing efficiency than glass laminates and is designed for long-term stable storage.
Thintronics on Substrate (TOS)
Substrates made with Thintronics deliver 30-50% better insertion loss at 224G/448G PAM4.
— PRODUCT —
Advanced Substrate Prototyping Demonstrator
High-speed test chips featuring semi-additive circuitry and ultra-fine pitch geometry for next-tier electronics packaging.
— APPLICATIONS —
One Platform, Every Layer
Thintronics dielectrics enable next-generation packaging across the interconnect stack—from high-speed substrates to advanced PCBs—with unified materials that simplify design and accelerate adoption.
Switch ASIC Substrates
High-speed networking ASICs demand ultra-low loss for clean signal channels. Thintronics enables higher density with minimal crosstalk at 224G+ speeds.
Photonics & Optical Interconnects
Optical integration requires precise dielectric stability. Thintronics delivers the material foundation for high-bandwidth optical links with lower power.
CoWoP & Direct Die Attach
Panel-level packaging demands dimensional stability and minimal warpage. Thintronics films maintain precision across large panels for reliable interconnects.
Interposer-less Architectures
Bridge-based packaging eliminates costly silicon interposers. Thintronics enables high-performance organic RDL alternatives with excellent electrical properties.
Chiplet & Slow-wide Interfaces
Chiplet architectures require low-loss die-to-die links at tight pitches. Thintronics supports UCIe-class bandwidth with the signal integrity these designs demand.
Ultra-HDI & Substrate-like PCBs
Next-gen PCBs approach IC substrate density. Thintronics is fully compatible with mSAP processes, enabling finer traces and higher routing density.
— ROADMAP —
We're Just Getting Started
We're launching with Thintronics on Substrate, a breakthrough for high-speed FCBGA substrates, but our roadmap extends further. Join the newsletter to stay connected.