Technology
Material science meets system design.
— PLATFORM —
Unifying the Interconnect
For decades, electronic systems have been built using a disaggregated supply chain and material sets: PCBs, substrates, interposers, laminates, build up films, and redistribution layers developed in isolation rather than as a unified, optimized system. The result is predictable: complex supply chains, inefficient architectures, and enormous power costs in today’s AI infrastructure. Thintronics is changing this.
Our Solution
A universal insulator that delivers near theoretical insertion loss and integrates into every standard build-up circuit manufacturing process (SAP, mSAP, ETS, and subtractive).
Why It Matters
The lines between PCBs, substrates, and interposers are blurring. A single, optimized insulator platform simplifies architectures, improves performance, and strengthens the supply chain. Thintronics provides the foundation for the transition to true heterogeneous integration.
Performance Foundation
The Lowest Insertion Loss: Period. Power Efficiency: Thintronics technology enables the transition to 224G–448G die-to-die and optical links with less equalization power, which can result in a 42% reduction in SERDES power. Frequency Stable: Our platform maintains signal fidelity at the extreme frequencies demanded by AI accelerators and high-performance computing, supporting data rates beyond 224Gbps.
Supply Chain Security
One form factor means one supply path: simplifying sourcing and reducing monopolistic bottlenecks. Thintronics also delivers an order of magnitude higher manufacturing efficiency than glass laminates and can be stored indefinitely.
Thintronics on Substrate (TOS)
Substrates made with Thintronics deliver 30-50% better insertion loss at 224G/448G PAM4.
— APPLICATIONS —
One Platform, Every Layer
Thintronics dielectrics enable next-generation packaging across the interconnect stack—from high-speed substrates to advanced PCBs—with unified materials that simplify design and accelerate adoption.
Switch ASIC Substrates
High-speed networking ASICs demand ultra-low loss for clean signal channels. Thintronics enables higher density with minimal crosstalk at 224G+ speeds.
Photonics & Optical Interconnects
Optical integration requires precise dielectric stability. Thintronics delivers the material foundation for high-bandwidth optical links with lower power.
CoWoP & Direct Die Attach
Panel-level packaging demands dimensional stability and minimal warpage. Thintronics films maintain precision across large panels for reliable interconnects.
Interposer-less Architectures
Bridge-based packaging eliminates costly silicon interposers. Thintronics enables high-performance organic RDL alternatives with excellent electrical properties.
Chiplet & Slow-wide Interfaces
Chiplet architectures require low-loss die-to-die links at tight pitches. Thintronics supports UCIe-class bandwidth with the signal integrity these designs demand.
Ultra-HDI & Substrate-like PCBs
Next-gen PCBs approach IC substrate density. Thintronics is fully compatible with mSAP processes, enabling finer traces and higher routing density.
— ROADMAP —
We're Just Getting Started
We're launching with Thintronics on Substrate, a breakthrough for high-speed FCBGA substrates, but our roadmap extends further. Join the newsletter to stay connected.