Press
Press kit and recent publications.
Press Kit
Please reach out for all press and media inquiries regarding Thintronics.
Get in touch for detailed press releases, high-resolution images, executive biographies, and to schedule interviews with our leadership team. Contact us to access the resources you need for accurate and current reporting on Thintronics and the exciting advancements we're bringing to the technological landscape.
Thintronics Secures Up to $50M from the U.S. Department of Commerce to Take on the Dielectric Bottleneck Holding Back AI.
“Thintronics has signed a Letter of Intent with the U.S. Department of Commerce for up to $50 million in CHIPS Act incentives to accelerate our next-generation substrate dielectric technology. The material at the heart of every chip substrate has long been treated as solved — it isn't. As AI pushes toward terabit interconnects, incumbent dielectrics are hitting physical limits, and nearly all of it comes from a single foreign supplier. This funding helps us fix both: building a U.S.-based alternative engineered for what the semiconductor industry actually needs now.”
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This US Startup Makes a Crucial Chip Material and Is Taking on a Japanese Giant
“It can be dizzying to try to understand all the complex components of a single computer chip: layers of microscopic components linked to one another through highways of copper wires, some barely wider than a few strands of DNA. Nestled between those wires is an insulating material called a dielectric, ensuring that the wires don't touch and short out. Zooming in further, there's one particular dielectric placed between the chip and the structure beneath it; this material, called dielectric film, is produced in sheets as thin as white blood cells...”
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Beyond Moore's Law: We Need To Rethink Materials For The New Computing Era
“As Moore's Law approaches its limits and AI workloads demand unprecedented energy efficiency, the semiconductor industry must rethink materials science. Traditional dielectric insulators optimized for mechanical robustness have become performance bottlenecks in high-speed, high-density environments. Companies like Thintronics are developing tunable, low-dielectric constant materials engineered at the molecular level to reduce signal loss and energy dissipation, potentially eliminating the need for expensive interposers and simplifying system designs...”
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Thintronics Secures Series a Extension to Advance High-Performance Insulators for Next-Gen Electronics
“Berkeley-based advanced materials startup Thintronics has secured an undisclosed Series A Extension, led by Maverick Capital and Translink Capital, to accelerate its mission of revamping insulator technology for high-performance electronics. The round, which includes strategic investments from M Ventures (Merck KGaA's corporate venture capital (CVC) arm) and TGVP (Toppan Holdings' U.S. CVC arm), will fuel Thintronics' expansion and support its efforts to displace fiberglass in advanced applications like AI data centers and 5G/6G infrastructure...”
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