Data demand has increased steadily over the last decade. AI integration has seen that demand grow exponentially.
Thintronics optimizes Interconnect Insulation enabling the highest data rates at the lowest power consumption.
Features
Next generation technology requires electronics to do more in less space at higher data rates and with the lowest power consumption.
Speed
Thintronics is enabling hi speed interconnect at 224 Gbps and 6G for wireless RF.
Power
Reducing channel loss delivers the lowest power consumption for high-speed interconnects.
Form Factor
50% thickness reduction with less weight for greater design and application flexibility.
Applications
AI Data Center
Optimizing power to process more data with the lowest pJ/bit.
Networking
Unified Insulator Platform across Compute, Switching and Networks.
RF Microwave
Reduced loss for RF systems with better connectivity and higher signal quality.
Devices
Massive design impact for next generation Interactive, Wearable, Edge AI, Entertainment…
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Leadership
Stefan Pastine, Ph.D.
Founder & CEO
Co-founder of Connora Technologies, which invented and commercialized technology that made an important industrial plastic recyclable (a.k.a. Recyclable Thermosets). The technology is currently used by Siemens-Gamesa to make recyclable windmill blades. Recyclable thermosets will divert 26 billion pounds of waste a year from landfills. Stefan led Connora from the founding concept through multiple financing rounds, R&D, scale-up, commercialization and finally through acquisition. Exited 2019.
Tristan El Bouyadi, Ph.D.
CTO
Engineering Leader with 14 years of experience in design and characterization RF, mmW, THz, Quantum Computing and High-Speed hardware in both early-stage and large-scale industrial environments. Experience in semiconductor co-design and manufacturing flows, Signal & Power Integrity, Antennas and Semiconductor Packaging.
Luc Beauviller
Sr. Director, Applications Engineering
PCB veteran with 25-years of experience in both PCB fabrication & PCB materials technical marketing. Former Director, OEM Marketing ITEQ Corporation and ISOLA Group. Extensive industry connections with key OEMS and PCB fabs both in the US and globally. Luc has worked for some of the most important PCB players in the industry.
Desi Banatao
Board Member
Former CEO of MIPS. Prior to the CEO role, Desi led the acquisition from Imagination. He has a broad range of experience in early-stage technology startups as entrepreneur and investor as one of the founding partners in Tallwood VC. Desi holds a BS and an MS in Materials Science from UC Berkeley.
Alexandra McManus
Board Member
Chairman of the Board and Co-Founder of Eyrus, a venture backed IOT software platform. Former BOD of Connora Technologies (sold in 2019). Former EVP focused on data and software in the construction industry (sold twice through PE). Holds an BS in Mechanical Engineering from Univ of MD, and an MBA from UC Berkeley.
Kenneth Safar
Board Member
Kenneth Safar is a Managing Director on Maverick’s technology investment team. Prior to joining Maverick in 2021, he was a private equity investment associate at Thomas H. Lee Partners, before that he worked in investment banking at Goldman, Sachs & Co. Mr. Safar holds an M.B.A. from Harvard Business School and a B.S. in finance and information systems from NYU Stern.
Brendan Walsh
Board Member
Brendan seeks investment opportunities in companies boasting strong, defensible technology, especially those in cloud computing infrastructure, serving data centers and enterprises across the full value chain, from semiconductors to sophisticated software applications, and he maintains a strategic focus on sustainability and innovative climate technologies for future growth.
Daniel Franke
Board Observer
Daniel is an Investment Director at M Ventures and responsible for tech investments out of M Ventures’ €600 million Science & Technology fund. Daniel joined M Ventures in the Performance Materials team in 2019. Daniel obtained his Bachelor’s and master’s in chemistry at RWTH Aachen University before moving on to the Massachusetts Institute of Technology for his Ph.D.
Careers
100% Employee Coverage for Health/Vision/Dental Insurance
Unlimited PTO Policy · Equity/Stock Options
Substrate Process Engineer
$160,000 - 190,000/yr · Berkeley, CA
We are looking for a talented Packaging Process Integration Engineer to support Thintronics’ adoption into advanced semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential.
Research Associate – Polymer Materials
$90,000 - 110,000/yr · Berkeley, CA
Thintronics is looking for a detail-oriented and enthusiastic research associate to join our R&D team. This role focuses on formulation/sample preparation and/or physical characterization of samples, including thermal, mechanical, adhesive, and dielectric property measurements. In this position, you will help deepen our understanding of the core Thintronics technology and develop our product pipeline.As part of a start-up team, you will wear many hats. We are looking for someone with a “can-do” attitude, who is excited about the opportunity to explore/develop a broad range of practical skills and loves hands-on work in the lab. Roles and responsibilities are collaborative and may evolve based on the needs of our quickly growing company as well as your skillset/interests.
Partners
Maverick Capital
Hedge Fund Firm
Maverick Capital is an American hedge fund firm. It was founded by Lee Ainslie in 1993, who was a "Tiger Cub" under Julian Robertson at Tiger Management, helped raise $38 million in capital by the family of Texas entrepreneur Sam Wyly. From 1995 to 2014, the fund returned a compounded return of 13% annually.
Translink Capital
Venture Capital Firm
Translink Capital is an early-stage venture capital firm based in Palo Alto with $1B under management, and investing out of its fifth fund. The fund’s mission is to partner with US entrepreneurs, and add value by leveraging the firm’s proprietary insights and connections to strategic Asian partners.
M Ventures
Venture Capital Firm
M Ventures is the strategic, corporate venture capital fund of Merck KGaA, Darmstadt, Germany, investing in Biotechnology and Technology. They cover the areas of Healthcare drug development, Life Science tools, Electronics and Frontier Technology & Sustainability.
TGVP
Venture Capital Firm
TGVP is the US Corporate Venture Capital arm of TOPPAN, Inc. Founded in 2022, the San Mateo based firm is focused on venture capital investments in US startup companies in Sustainability and Digital Transformation.
Ansys
Engineering Simulation Software
Ansys, Inc. is an American multinational company with its headquarters based in Canonsburg, Pennsylvania. It develops and markets CAE/multiphysics engineering simulation software for product design, testing and operation and offers its products and services to customers.
The National Science Foundation
United States Government Agency
The National Science Foundation is an independent agency of the United States federal government that supports fundamental research and education in all the non-medical fields of science and engineering. Its medical counterpart is the National Institutes of Health.
Press Kit
For all press and media inquiries regarding Thintronics, our innovative technologies, and how we're steering the future of high-speed data transfer and AI integration, please reach out to press@thintronics.com.Get in touch for detailed press releases, high-resolution images, executive biographies, and to schedule interviews with our leadership team. Contact us to access the resources you need for accurate and current reporting on Thintronics and the exciting advancements we're bringing to the technological landscape.
Thintronics Secures Series a Extension to Advance High-Performance Insulators for Next-Gen Electronics
https://www.rdworldonline.com/thintronics-secures-series-a-extension-for-advanced-insulators-in-next-gen-electronics/Berkeley-based advanced materials startup Thintronics has secured an undisclosed Series A Extension, led by Maverick Capital and Translink Capital, to accelerate its mission of revamping insulator technology for high-performance electronics. The round, which includes strategic investments from M Ventures (Merck KGaA’s corporate venture capital (CVC) arm) and TGVP (Toppan Holdings’ U.S. CVC arm), will fuel Thintronics’ expansion and support its efforts to displace fiberglass in advanced applications like AI data centers and 5G/6G infrastructure...
This US Startup Makes a Crucial Chip Material and Is Taking on a Japanese Giant
https://www.technologyreview.com/2024/04/11/1091143/thintronics-ajinomoto-dielectric-chip-semiconductor-competition/It can be dizzying to try to understand all the complex components of a single computer chip: layers of microscopic components linked to one another through highways of copper wires, some barely wider than a few strands of DNA. Nestled between those wires is an insulating material called a dielectric, ensuring that the wires don’t touch and short out. Zooming in further, there’s one particular dielectric placed between the chip and the structure beneath it; this material, called dielectric film, is produced in sheets as thin as white blood cells...
Thintronics Inc. Closes $23M Series A Financing Round Led by Maverick Capital and Translink Capital
https://finance.yahoo.com/news/thintronics-inc-closes-series-extension-210600462.htmlThintronics Inc. is a California-based electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications. Thintronics Inc. has raised a Series A funding round for $23M, led by Maverick Capital and Translink Capital. Series A funding will support commercialization of a novel insulator platform...